When designing a high-efficiency power supply with output power between 100 W and 250 W, should you go with the active clamp flyback (ACF) topology or the LLC half-bridge resonant...
Designers of automotive subsystems, like traction inverters, face the constant challenge of high ambient temperatures. Is it worth the price to go with a thermal pad with very high conductivity...
Director of Automotive Business Development Peter Vaughan introduces RDR-919Q, a 60 W power supply design for 800 V bus using SiC-based InnoSwitch3-AQ switcher ICs that eliminates the need for a...
During this June 29 technical presentation at PowerUp Expo 2022, Director of Technical Outreach Andy Smith breaks down how to increase power in non-isolated (buck) conversion, simplify isolated converter design...
During this June 29 keynote at PowerUP Expo 2022, Sr. Product Marketing Manager Cristian IonescuCatrina discusses the growth in the market for BLDC and permanent magnet motors that address the...
Typical power adapters for our electronic devices continuously waste energy as long as they are plugged in. Just how much energy (and money) are these energy vampires sucking away?
Both regulatory and technological tools have significantly reduced the amount of energy wasted by electronic devices in standby mode. Director of Applications Engineering David Chen explains.
The SCALE EV family of gate-driver boards for Infineon™ EconoDUAL™ modules featuring reinforced isolation are suitable for original, clone and new SiC variants. The new product targets high-power automotive and...
Highly integrated InnoSwitch3-TN flyback switcher ICs are ideal for smart-connected appliances that require high efficiency during light load and low component count, which are increasingly difficult to realize with traditional...
The HiperPFS-5 high-efficiency quasi-resonant PFC ICs with 750 V PowiGaN switch enable compact power-factor stage for ultra-fast chargers, consumer electronics, computer and appliance power supplies. Vice President of Marketing Doug...
The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98%...
Director of Automotive Business Development Peter Vaughan discusses how Power Integrations products properly tested for EMI can reduce the risk and time associated with the development of automobiles.
