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Application Notes

Showing 1 - 13 of 13 Application Notes
产品描述
AN-98 - LinkSwitch-TNZ Family Buck and Buck-Boost Design Guide
Description

This application note provides information for designing a non-isolated power supply using the LinkSwitch-TNZ family of devices. This document describes the design procedure for buck and buck-boost converters.

AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages
Description

This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.

AN-75 - LYTSwitch-6 产品系列设计指南
Description

LYTSwitch-6 产品系列设计指南

AN-70 - LinkSwitch-TN2 设计指南
Description
AN-65 LYTSwitch-5应用指南
Description
AN-60 - LYTSwitch-0 应用指南
Description

LYTSwitch-0 应用指南

AN-59 - LYTSwitch-4 Design Guide
Description
AN-303 - Qspeed Family RoHS Compliant Soldering Considerations
Description

Qspeed Family RoHS Compliant Soldering Considerations

AN-302 - Qspeed Reverse Voltage Sharing of Series Rectifiers
Description

Reverse Voltage Sharing of Series Rectifiers

AN-301 - Qspeed Reverse Recovery Charge, Current and Time
Description

Reverse Recovery Charge, Current and Time

AN-300 - Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing
Description

Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing

应用指南AN-55 HiperLCS 产品系列
Description

应用指南AN-55 HiperLCS 产品系列

AN-39 - LinkSwitch-LP 反激式设计指南
Description LinkSwitch-LP 反激式设计指南