Our product is using DPA423R package, but DPA423R package is not RoHS compliant.
Followed is the reply from you.
Could you recommend the heatsink for DPA425GN?
Please, Share heatsink information (for example Vendor, Vendor P/N and Thermal impedance and etc....)
Thanks and best regards
SY

Hello SY,
your requested information is below

Cheers

PI-Chekov

Unfortunately the R package does not support higher temperature lead-free soldering profile and cannot therefore be converted to lead-free. S PAK had to be withdrawn from manufacture last year when the packaging company indicated that they would no longer support this type of device. DPA425GN/PN DIP packages are both lead-free may be an alternative to the R package DPA423R. While they have higher thermal impedance they have lower dissipation. Please contact your local PI sales office (http://www.powerint.com/en/company/sales-information/worldwide-sales-support-locations) to discuss options and how these devices can be used with heatsinks if necessary.